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Driver package

Download ZIP · 0.1 MBSignature verified on receipt

Package information

Windows
11 · amd64 · collected on build 22000
Received
2026-09-11
SHA-256
2f7eb5dde0d68e0821a9a74ef9f04fb9950f7e1bddebbabc838d43df41c80a51
Contents
3 files · 1 INF definitions

Qualcomm Technologies, Incorporated · SYSTEM

INF
qcSubsysThermalMgr8480.inf
Version
00685.13804.00010.00000 · 2025-12-23
Catalog
qcsubsysthermalmgr8480.cat

Declared hardware support

Architecture and Windows build constraints are checked by the client before installation.

DeviceHardware IDArchitectureMinimum build
Qualcomm(R) Subsys Thermal Mitigation DeviceACPI\QCOMFFDFarm6416299
Qualcomm(R) Subsys Base Thermal Mitigation DeviceACPI\QCOM1005arm6416299