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Driver package

Download ZIP · 0.1 MBSignature verified on receipt

Package information

Windows
11 · arm64 · collected on build 28000
Received
2026-09-08
SHA-256
472a7764272c3e5f629c1dca13caa2af46864ef94e89ed59c298ac80e3c5ca54
Contents
3 files · 1 INF definitions

Qualcomm Technologies, Incorporated · SYSTEM

INF
qcSubsysThermalMgr8480.inf
Version
00698.49800.00000.00000 · 2026-04-01
Catalog
qcSubsysThermalMgr8480.cat

Declared hardware support

Architecture and Windows build constraints are checked by the client before installation.

DeviceHardware IDArchitectureMinimum build
Qualcomm(R) Subsys Thermal Mitigation DeviceACPI\QCOMFFDFarm6416299
Qualcomm(R) Subsys Base Thermal Mitigation DeviceACPI\QCOM1005arm6416299