Driver package
Download ZIP · 0.1 MBSignature verified on receipt
Package information
- Windows
- 11 · arm64 · collected on build 26200
- Received
- 2026-09-06
- SHA-256
9e765e3454c874b233561b8f755ad0f4c77ecc10a8ac86cd6a388c689b52bb38- Contents
- 3 files · 1 INF definitions
Qualcomm Technologies, Incorporated · SYSTEM
- INF
qcsubsysthermalmgr.inf- Version
- 1.0.4160.6000 · 2024-10-29
- Catalog
- qcSubsysThermalMgr.cat
Declared hardware support
| Device | Hardware ID | Architecture | Minimum build |
|---|---|---|---|
| Qualcomm(R) Subsys Thermal Mitigation Device | ACPI\QCOMFFE0 | arm64 | 16299 |
| Qualcomm(R) Subsys Base Thermal Mitigation Device | ACPI\QCOM06E5 | arm64 | 16299 |