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Driver package

Download ZIP · 0.1 MBSignature verified on receipt

Package information

Windows
11 · arm64 · collected on build 26200
Received
2026-09-06
SHA-256
9e765e3454c874b233561b8f755ad0f4c77ecc10a8ac86cd6a388c689b52bb38
Contents
3 files · 1 INF definitions

Qualcomm Technologies, Incorporated · SYSTEM

INF
qcsubsysthermalmgr.inf
Version
1.0.4160.6000 · 2024-10-29
Catalog
qcSubsysThermalMgr.cat

Declared hardware support

Architecture and Windows build constraints are checked by the client before installation.

DeviceHardware IDArchitectureMinimum build
Qualcomm(R) Subsys Thermal Mitigation DeviceACPI\QCOMFFE0arm6416299
Qualcomm(R) Subsys Base Thermal Mitigation DeviceACPI\QCOM06E5arm6416299