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Driver package

Download ZIP · 0.1 MBSignature verified on receipt

Package information

Windows
11 · arm64 · collected on build 26200
Received
2026-09-09
SHA-256
cb2c479ed2a37db933a1a00a8d16464d05e27458ed26a7b76b7b4c878034d611
Contents
3 files · 1 INF definitions

Qualcomm Technologies, Incorporated · SYSTEM

INF
qcSubsysThermalMgr.inf
Version
1.0.4458.2600 · 2025-10-16
Catalog
qcsubsysthermalmgr.cat

Declared hardware support

Architecture and Windows build constraints are checked by the client before installation.

DeviceHardware IDArchitectureMinimum build
Qualcomm(R) Subsys Thermal Mitigation DeviceACPI\QCOMFFE0arm6416299
Qualcomm(R) Subsys Base Thermal Mitigation DeviceACPI\QCOM06E5arm6416299