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Driver package

Download ZIP · 0.1 MBSignature verified on receipt

Package information

Windows
11 · arm64 · collected on build 26100
Received
2026-09-08
SHA-256
f5b22b22e380ff123eaf66c8a55179d861c3c992a397eeb3713b5b5a03d94a7d
Contents
3 files · 1 INF definitions

Qualcomm Technologies, Incorporated · SYSTEM

INF
qcSubsysThermalMgr.inf
Version
1.0.4281.8500 · 2025-04-08
Catalog
qcSubsysThermalMgr.cat

Declared hardware support

Architecture and Windows build constraints are checked by the client before installation.

DeviceHardware IDArchitectureMinimum build
Qualcomm(R) Subsys Thermal Mitigation DeviceACPI\QCOMFFE0arm6416299
Qualcomm(R) Subsys Base Thermal Mitigation DeviceACPI\QCOM06E5arm6416299